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Inactive lesions (IA): These lesions showed no evidence for ongoing myelin destruction at their borders. Although some of these lesions too contained T cells and macrophages, their number was much lower compared to active ones.
Poser 8 Serial Number 60
To assess the extent of inflammation, CLA-positive elements were counted in a 0.1 mm 2 field in the respective lesions. Total number of MS lesional areas analyzed: n = 240; among those: n = 36 early active (EA), n = 13 late active (LA), n = 29 inactive center with active border (IA + A), n = 21 inactive (IA), n = 26 remyelination (RM), n = 36 normal white matter (NWM) of cases with active lesions (active MS), n = 41 periplaque white matter (PP) of cases with active lesions (active MS), n = 15 normal white matter (NWM) of cases with only inactive and/or remyelinating lesions (inactive MS), n = 23 periplaque white matter (PP) of cases with only inactive and/or remyelinating lesions (inactive MS); n = 27 white matter of controls (CO). Because there were no regional or interindividual differences in βAPP reactivity in normal white matter of controls, the same controls were used for all comparisons.
The total number of EAE lesional areas analyzed: n = 55; among those, n = 16 early active (EA), n = 12 late active (LA), n = 11 inactive plus active border (IA + A), n = 4 remyelination with superimposed demyelinating activity (RM-A), n = 12 white matter of control animals (CO).
Recent work of axonal changes after trauma suggests that some axonal damage may be repaired. 45 This may also be reflected in the normalization of NAA levels within MS lesions and NAWM six months after the acute phase of lesion formation in early MS. 46 Therefore, reactive axonal changes as seen by immunocytochemistry for βAPP may be reversible unless they have not led to the formation of fully developed terminal ovoids. Intervention at an early time point of plaque formation, therefore, might not only reduce acute axonal injury, but also reduce the number of injured axons that undergo definite degeneration.
The Summit product family includes a wide variety of Interposer systems, designed to reliably capture serial data traffic while minimizing perturbations in the serial data stream. Probes include interposers, which are designed to capture data traffic crossing the PCI Express card connector interface, and MidBus probes, which are designed to capture traffic flowing within a PCB.
The PCIe 5.0 CEM Interposer for x8 support data rates of 2.5 GT/s (Gen1), 5.0 GT/s (Gen2), 8.0 GT/S (Gen3), 16.0 GT/S (Gen4), and 32 GT/s(Gen5). A separate Y or straight cable must be used to connect to a Summit T54 or M5x PCIe protocol analyzer.
The PCIe 5.0 EDSFF Interposers provides connectivity and monitoring capability for E1.S, E1.L or E3.x type devices targeted at enterprise systems that use the SFF-TA-1002 multi-lane card edge connector. The interposer taps all PCIe protocol traffic between the host and EDSFF device or SSD and records it on the Summit PCIe 5.0 protocol analyzer where protocol issues and performance metrics can be further analyzed and debugged.
The PCIe 5.0 M.2 interposer provides connectivity and monitoring capability for M.2 connector based SSD memory modules targeted at thin client devices such as tablets. The interposer supports 30mm x 22mm, 42mm x 22mm, 60mm x 22mm, 80mm x 22mm , and 110mm x 22mm SSD lengths. This interposer optionally supports the CrossSync PHY technology enabling users to see and correlate both the physical and protocol layers in a unified time aligned view.
The PCIe 5.0 MCIO 74 Pin Cable Interposes provides connectivity and monitoring capability for product designs that incorporate card edge connectors or cabled connector assemblies that utilize the MCIO mechanical connector based on the SFF-TA-1016 specification with PCIe 5.0, NVM Express (NVMe) or Compute Express Link (CXL) technologies. The interposer taps all PCIe protocol traffic on the MCIO cable between host and device and records it on the Summit PCIe 5.0 protocol analyzer where protocol issues and performance metrics can be further analyzed and debugged.
The PCIe 5.0 OCP NIC 3.0 Interposer allows users to connect a Teledyne LeCroy T4/T5 PCIe(r) protocol analyzer between an OCP NIC 3.0 device and an OCP Server System to monitor, capture, record and analyze protocol traffic. The interposer supports data rates of 2.5 GT/s, 5.0 GT/s, 8.0 GT/s, 16.0 and 32 GT/s, side band signals such as PERST#, WAKE# and SMBus (SMBCLK, SMBDAT). The PCIe 5.0 OCP NIC 3.0 Interposer supports link widths up to x16 and single/multi-hosted configurations.
The PCIe 5.0 U.2/ U.3 (SFF-8639) Interposer is a PCIe Storage Interposer that makes it possible to analyze data traffic from PCIe SSD storage devices to PCIe Storage systems using the U.2/U.3 (SFF-8639) connector. It allows x4 NVM Express, x4SCSI Express or x2 SATA Express host interface based SSD traffic to be monitored, captured and recorded. It supports SRIS, CLCKREQ#, SMBus and Dual port mode when used with MultiPort software option. There are two types of interposer: a 6 inch and 12 inch interposer. The 12 inch model is CrossSync PHY capable.
The PCIe 4.0 OCP NIC 3.0 Interposer allows users to connect a Teledyne LeCroy T4/T5 PCIe protocol analyzer between an OCP NIC 3.0 device and an OCP Server System to monitor, capture, record and analyze protocol traffic. The interposer supports data rates of 2.5 GT/s, 5.0 GT/s, 8.0 GT/s and 16.0 GT/s, side band signals such as PERST#, WAKE# and SMBus (SMBCLK, SMBDAT). The PCIe 4.0 OCP NIC 3.0 Interposer supports link widths up to x16 and single/multi-hosted configurations.
Connections from the dish to the DUT are made using the high-speed SMP connectors mounted on the dish board, which allow connection to test points on the DUT using standard coaxial cables. This allows far more flexibility in connecting signals from different locations on the DUT board, or even from multiple boards and backplanes. Some examples of the flexibility provided by the dish board include connecting an analyzer in a simple chip-to-chip serial interconnect test environment (as shown below), connecting an add-in card via a standard PCIe slot, and connecting a cable or backplane assembly to test signal transmission in real application environments.
The Gen2 x16 Active Interposer is for use with the Summit T3-16 Analyzer (or with two Summit T3-8 Analyzers). The Gen2 x8 Active Interposer is for use with the Summit T3-16, the Summit T3-8 and the Summit T28. The Gen2 x8 Active Interposer is also available in a version which supports CLKREQ# and SRIS for testing low power modes supported by these features.
The HP Blade Server Interposer is a specialty probe that makes it possible to analyze data traffic from a blade server designed for an HP BladeSystem to the host system. To use the HP Blade Server Interposer, simply plug the blade server you want to test into the interposer, then plug the interposer into the host system. The interposer provides a number of test points and a connector to attach a Teledyne LeCroy PCI Express protocol analyzer.
The XMC Mezzanine Card Interposers are specialty probes that make it possible to analyze data traffic from a VITA 42.3 Switched Mezzanine Card (XMC) that uses a PCI Express interface to connect to the carrier board system. To use an XMC Interposer, simply plug the XMC card you want to test into the interposer, then plug the interposer into the host system. The interposer provides a number of test points and a connector to attach a Teledyne LeCroy PCI Express protocol analyzer.
There are two versions of the XMC Interposer supplied by Teledyne LeCroy: (a) a Gen1 (2.5 GT/s) version primarily intended for use with the PETracer ML Analyzer (but compatible with the Summit T2-16 and Summit T3-16 Analyzers), and (b) a Gen2 (supporting 2.5 GT/s and 5 GT/s) intended for use with the Summit T2-16 or Summit T3-16 Analyzers.
Thunderbolt (previously called Light Peak) is a hardware interface that combines data, video, audio, and power in a single connection. Thunderbolt combines PCI Express (PCIe) and DisplayPort (DP) into one serial signal and also provides DC power, all in one cable. While Thunderbolt 1 and Thunderbolt 2 use the same connector as mini-DP (DisplayPort) to connect to peripherals, Thunderbolt 3 uses a USB-C connector.
Computed tomography (CT) and/or MRI (superconducting 1.5 Tesla scanner) were performed during the acute stage of illness. CT was done using a third generation scanner and contrast enhanced images were obtained. MRI T1-weighted, T2-weighted and fluid-attenuated inversion recovery (FLAIR) sequences were acquired in the axial, sagittal and coronal planes. When feasible, contrast enhanced images were obtained using gadopentetate dimeglumine (0.1 mmol/kg). CT and MR images were read independently by a radiologist (JMEK) and number of lesions, distribution, hemorrhage, midline shift and pattern of contrast enhancement were noted. Standard 30-minute interictal surface electroencephalogram (EEG) was recorded in patients with impaired consciousness or seizures.
Other parameters found to predict poor outcome include extent of lesions in the white matter [7] and brainstem. [16] Patients with acute hemorrhagic leukoencephalitis are expected to have poor outcome. [17] However, limited number of patients with this condition restricted the analysis of this variable. 2ff7e9595c
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